RF / Wireless Design
From RF Power Amplifiers to full 802.11 modems, Amkor is committed to enabling our customers through our interactive RF Design and Applications Services. We help you optimize the cost, size and performance in your product choices and provide RF design services to improve your cycle time. Amkor RF design engineers know what our customers concerns are and how to achieve them. After all, our engineers have come from the ranks of RF and microwave product design organizations ranging from hybrid modules to handsets.
TEPBGA (Thermally Enhanced PBGA)
Amkor's TEPBGA's feature a drop-in heat spreader and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors (silicon). Amkor's PBGAs are designed for low inductance, improved thermal operation and enhanced SMT-ability. Custom performance enhancements, such as ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics.
Press Releases
| 06/29/09 | Amkor Announces Management Succession Plan |
| 05/15/09 | Amkor to Present at JP Morgan Technology Conference |
| 04/29/09 | Amkor Reports First Quarter 2009 Results |
| 04/28/09 | Toshiba, Nakaya and Amkor Sign Memorandum of Understanding on Forming a Joint Venture for System LSI Assembly and Test Service |
| 04/16/09 | Amkor Announces Closing of $100 Million Senior Secured Revolving Credit Facility |
Data Sheets
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