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97%
About Us
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Amkor provides leading-edge package solutions such as Package on Package (PoP), Stacked Packaging, Flip Chip, ... /go/about-us/about-us |
96%
Japan Manufacturing Facility & Sales Office
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Amkor Japan offers a wide array of laminate and leadframe packages, including PBGA, ChipArray, PLCC, SOIC, /go/contact-us/japan/japan-manufacturing-facility-and-sales-office |
94%
Common Platform
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Wafer Probe Test software & probe development Digital, analog, mixed-signal, RF, logic & memory test Integrated EDI yield feedback Dedicated Singapore resources allowing reduced cycle for Common Platform customers. Wafer Bump Electro-plated wafer bumping Redistribution layer (RDL) technology High volume /go/packaging/common-platform/common-platform |
93%
Philippines Manufacturing Facility & Sales Office
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Amkor’s Philippines factories contain over 1.3 million square feet of manufacturing space and provide a full range of assembly and test services including ceramic, leadframe, laminate such as PBGA, ... /go/contact-us/philippines/philippines-manufacturing-facility-and-sales-office |
92%
Turnkey Services
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By becoming involved in the customers' projects as early as possible, Amkor feels they can add benefits such as Electrical Package Characterization and Thermal Package Characterization. Getting involved at the die design phase also allows Amkor's Packaging /go/turnkey-services/turnkey-services |
91%
Strip Test
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Development and Engineering Services: Test Hardware Design & development at Amkor Implementation, qualification & maintenance Tester / handler interface Contactors Load boards Program Development Production programs for all Amkor standard platforms Singulated and / or strip QA programs Development resources in Philippines Product Engineering <li... /go/test-services/strip-test/strip-test |
90%
Thermal Package Characterization
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Thermal Test Reports Amkor amassed over 100 thermal test reports covering a wide array of packages ranging from power application packages such as a PSOP 2 & 3, leaded packages such as LQFP, exposed pad packages such as /go/turnkey-services/thermal-characterization/thermal-package-characterization |
90%
Korea Manufacturing Facility & Sales Office
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Some of the packages assembled here are PBGA, TEPBGA, SuperBGA®, and /go/contact-us/korea/korea-manufacturing-facility-and-sales-office |
90%
Taiwan Manufacturing Facility & Sales Office
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Amkor Taiwan provides an extensive offering of advanced package and test services for consumer applications, including turnkey Flip Chip solutions encompassing wafer bump, wafer probe, assembly and final test. Amkor also offers... /go/contact-us/taiwan/taiwan-manufacturing-facility-and-sales-office |
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Amkor is now focusing on developing technology such as Camera Modules / Image Sensor, System in Package (SiP), improved interconnect with flip chip technology, and... /go/packaging/enabling-technologies/enabling-technologies |